1 Introduction to Research & Analysis Reports |
1.1 Wafer Level Packaging Market Definition |
1.2 Market Segments |
| 1.2.1 Segment by Type |
| 1.2.2 Segment by Application |
1.3 China Wafer Level Packaging Market Overview |
1.4 Methodology & Sources of Information |
| 1.4.1 Research Methodology |
| 1.4.2 Research Process |
| 1.4.3 Base Year |
2 China Wafer Level Packaging Overall Market Size |
2.1 China Wafer Level Packaging Market Size: 2021 VS 2027 |
2.2 China Wafer Level Packaging Revenue, Prospects & Forecasts: 2016-2027 |
2.3 China Wafer Level Packaging Sales: 2016-2027 |
3 Company Landscape |
3.1 Top Wafer Level Packaging Players in China Market |
3.2 Top China Wafer Level Packaging Companies Ranked by Revenue |
3.3 China Wafer Level Packaging Revenue by Companies |
3.4 China Wafer Level Packaging Sales by Companies |
3.5 China Wafer Level Packaging Price by Manufacturer (2016-2021) |
3.6 Top 3 and Top 5 Wafer Level Packaging Companies in China Market, by Revenue in 2020 |
3.7 Manufacturers Wafer Level Packaging Product Type |
3.8 Tier 1, Tier 2 and Tier 3 Wafer Level Packaging Players in China Market |
| 3.8.1 List of Tier 1 Wafer Level Packaging Companies in China |
| 3.8.2 List of Tier 2 and Tier 3 Wafer Level Packaging Companies in China |
4 Sights by Type |
4.1 Overview |
| 4.1.1 By Type - China Wafer Level Packaging Market Size Markets, 2021 & 2027 |
| 4.1.2 3D TSV WLP |
| 4.1.3 2.5D TSV WLP |
| 4.1.4 WLCSP |
| 4.1.5 Nano WLP |
| 4.1.6 Others ( 2D TSV WLP and Compliant WLP) |
4.2 By Type - China Wafer Level Packaging Revenue & Forecasts |
| 4.2.1 By Type - China Wafer Level Packaging Revenue, 2016-2021 |
| 4.2.2 By Type - China Wafer Level Packaging Revenue, 2022-2027 |
| 4.2.3 By Type - China Wafer Level Packaging Revenue Market Share, 2016-2027 |
4.3 By Type - China Wafer Level Packaging Sales & Forecasts |
| 4.3.1 By Type - China Wafer Level Packaging Sales, 2016-2021 |
| 4.3.2 By Type - China Wafer Level Packaging Sales, 2022-2027 |
| 全:文：http://www.miaohuangjin.cn/2/31/China-Wafer-Level-Packaging-Market-In-Depth-Research-and-Trends-Report-2022-2027.html |
| 4.3.3 By Type - China Wafer Level Packaging Sales Market Share, 2016-2027 |
4.4 By Type - China Wafer Level Packaging Price (Manufacturers Selling Prices), 2016-2027 |
5 Sights by Application |
5.1 Overview |
| 5.1.1 By Application - China Wafer Level Packaging Market Size, 2021 & 2027 |
| 5.1.2 Electronics |
| 5.1.3 IT & Telecommunication |
| 5.1.4 Industrial |
| 5.1.5 Automotive |
| 5.1.6 Aerospace & Defense |
| 5.1.7 Healthcare |
| 5.1.8 Others (Media & Entertainment and Non-Conventional Energy Resources) |
5.2 By Application - China Wafer Level Packaging Revenue & Forecasts |
| 5.2.1 By Application - China Wafer Level Packaging Revenue, 2016-2021 |
| 5.2.2 By Application - China Wafer Level Packaging Revenue, 2022-2027 |
| 5.2.3 By Application - China Wafer Level Packaging Revenue Market Share, 2016-2027 |
5.3 By Application - China Wafer Level Packaging Sales & Forecasts |
| 5.3.1 By Application - China Wafer Level Packaging Sales, 2016-2021 |
| 5.3.2 By Application - China Wafer Level Packaging Sales, 2022-2027 |
| 5.3.3 By Application - China Wafer Level Packaging Sales Market Share, 2016-2027 |
5.4 By Application - China Wafer Level Packaging Price (Manufacturers Selling Prices), 2016-2027 |
6 Manufacturers & Brands Profiles |
6.1 Amkor Technology Inc |
| 6.1.1 Amkor Technology Inc Corporation Information |
| 6.1.2 Amkor Technology Inc Overview |
| 6.1.3 Amkor Technology Inc Wafer Level Packaging Sales and Revenue in China Market (2016-2021) |
| 6.1.4 Amkor Technology Inc Wafer Level Packaging Product Description |
| 6.1.5 Amkor Technology Inc Recent Developments |
6.2 Fujitsu Ltd |
| 6.2.1 Fujitsu Ltd Corporation Information |
| 6.2.2 Fujitsu Ltd Overview |
| 6.2.3 Fujitsu Ltd Wafer Level Packaging Sales and Revenue in China Market (2016-2021) |
| 6.2.4 Fujitsu Ltd Wafer Level Packaging Product Description |
| 6.2.5 Fujitsu Ltd Recent Developments |
6.3 Jiangsu Changjiang Electronics |
| 6.3.1 Jiangsu Changjiang Electronics Corporation Information |
| 6.3.2 Jiangsu Changjiang Electronics Overview |
| 6.3.3 Jiangsu Changjiang Electronics Wafer Level Packaging Sales and Revenue in China Market (2016-2021) |
| 6.3.4 Jiangsu Changjiang Electronics Wafer Level Packaging Product Description |
| 6.3.5 Jiangsu Changjiang Electronics Recent Developments |
6.4 Deca Technologies |
| 6.4.1 Deca Technologies Corporation Information |
| 6.4.2 Deca Technologies Overview |
| 6.4.3 Deca Technologies Wafer Level Packaging Sales and Revenue in China Market (2016-2021) |
| 6.4.4 Deca Technologies Wafer Level Packaging Product Description |
| 6.4.5 Deca Technologies Recent Developments |
6.5 Qualcomm Inc |
| 6.5.1 Qualcomm Inc Corporation Information |
| 6.5.2 Qualcomm Inc Overview |
| 6.5.3 Qualcomm Inc Wafer Level Packaging Sales and Revenue in China Market (2016-2021) |
| 6.5.4 Qualcomm Inc Wafer Level Packaging Product Description |
| 6.5.5 Qualcomm Inc Recent Developments |
6.6 Toshiba Corp |
| 6.6.1 Toshiba Corp Corporation Information |
| 6.6.2 Toshiba Corp Overview |
| 6.6.3 Toshiba Corp Wafer Level Packaging Sales and Revenue in China Market (2016-2021) |
| 6.6.4 Toshiba Corp Wafer Level Packaging Product Description |
| 6.6.5 Toshiba Corp Recent Developments |
6.7 Tokyo Electron Ltd |
| 6.7.1 Tokyo Electron Ltd Corporation Information |
| 6.7.2 Tokyo Electron Ltd Overview |
| 6.7.3 Tokyo Electron Ltd Wafer Level Packaging Sales and Revenue in China Market (2016-2021) |
| 6.7.4 Tokyo Electron Ltd Wafer Level Packaging Product Description |
| 6.7.5 Tokyo Electron Ltd Recent Developments |
6.8 Applied Materials, Inc |
| 6.8.1 Applied Materials, Inc Corporation Information |
| 6.8.2 Applied Materials, Inc Overview |
| 6.8.3 Applied Materials, Inc Wafer Level Packaging Sales and Revenue in China Market (2016-2021) |
| 6.8.4 Applied Materials, Inc Wafer Level Packaging Product Description |
| 6.8.5 Applied Materials, Inc Recent Developments |
6.9 ASML Holding NV |
| 6.9.1 ASML Holding NV Corporation Information |
| 6.9.2 ASML Holding NV Overview |
| 6.9.3 ASML Holding NV Wafer Level Packaging Sales and Revenue in China Market (2016-2021) |
| 6.9.4 ASML Holding NV Wafer Level Packaging Product Description |
| 6.9.5 ASML Holding NV Recent Developments |
6.10 Lam Research Corp |
| 6.10.1 Lam Research Corp Corporation Information |
| 6.10.2 Lam Research Corp Overview |
| 6.10.3 Lam Research Corp Wafer Level Packaging Sales and Revenue in China Market (2016-2021) |
| 2022-2027年中國(guó)晶圓級(jí)封裝市場(chǎng)深度研究與趨勢(shì)報(bào)告 |
| 6.10.4 Lam Research Corp Wafer Level Packaging Product Description |
| 6.10.5 Lam Research Corp Recent Developments |
6.11 KLA-Tencor Corration |
| 6.11.1 KLA-Tencor Corration Corporation Information |
| 6.11.2 KLA-Tencor Corration Overview |
| 6.11.3 KLA-Tencor Corration Wafer Level Packaging Sales and Revenue in China Market (2016-2021) |
| 6.11.4 KLA-Tencor Corration Wafer Level Packaging Product Description |
| 6.11.5 KLA-Tencor Corration Recent Developments |
6.12 China Wafer Level CSP Co. Ltd |
| 6.12.1 China Wafer Level CSP Co. Ltd Corporation Information |
| 6.12.2 China Wafer Level CSP Co. Ltd Overview |
| 6.12.3 China Wafer Level CSP Co. Ltd Wafer Level Packaging Sales and Revenue in China Market (2016-2021) |
| 6.12.4 China Wafer Level CSP Co. Ltd Wafer Level Packaging Product Description |
| 6.12.5 China Wafer Level CSP Co. Ltd Recent Developments |
6.13 Marvell Technology Group Ltd |
| 6.13.1 Marvell Technology Group Ltd Corporation Information |
| 6.13.2 Marvell Technology Group Ltd Overview |
| 6.13.3 Marvell Technology Group Ltd Wafer Level Packaging Sales and Revenue in China Market (2016-2021) |
| 6.13.4 Marvell Technology Group Ltd Wafer Level Packaging Product Description |
| 6.13.5 Marvell Technology Group Ltd Recent Developments |
6.14 Siliconware Precision Industries |
| 6.14.1 Siliconware Precision Industries Corporation Information |
| 6.14.2 Siliconware Precision Industries Overview |
| 6.14.3 Siliconware Precision Industries Wafer Level Packaging Sales and Revenue in China Market (2016-2021) |
| 6.14.4 Siliconware Precision Industries Wafer Level Packaging Product Description |
| 6.14.5 Siliconware Precision Industries Recent Developments |
6.15 Nanium SA |
| 6.15.1 Nanium SA Corporation Information |
| 6.15.2 Nanium SA Overview |
| 6.15.3 Nanium SA Wafer Level Packaging Sales and Revenue in China Market (2016-2021) |
| 6.15.4 Nanium SA Wafer Level Packaging Product Description |
| 6.15.5 Nanium SA Recent Developments |
6.16 STATS Chip |
| 6.16.1 STATS Chip Corporation Information |
| 6.16.2 STATS Chip Overview |
| 6.16.3 STATS Chip Wafer Level Packaging Sales and Revenue in China Market (2016-2021) |
| 6.16.4 STATS Chip Wafer Level Packaging Product Description |
| 6.16.5 STATS Chip Recent Developments |
6.17 PAC Ltd |
| 6.17.1 PAC Ltd Corporation Information |
| 6.17.2 PAC Ltd Overview |
| 6.17.3 PAC Ltd Wafer Level Packaging Sales and Revenue in China Market (2016-2021) |
| 6.17.4 PAC Ltd Wafer Level Packaging Product Description |
| 6.17.5 PAC Ltd Recent Developments |
7 China Wafer Level Packaging Production Capacity, Analysis |
7.1 China Wafer Level Packaging Production Capacity, 2016-2027 |
7.2 Wafer Level Packaging Production Capacity of Key Manufacturers in China Market |
8 Key Market Trends, Opportunity, Drivers and Restraints |
8.1 Market Opportunities & Trends |
8.2 Market Drivers |
8.3 Market Restraints |
9 Wafer Level Packaging Supply Chain Analysis |
9.1 Wafer Level Packaging Industry Value Chain |
9.2 Wafer Level Packaging Upstream Market |
9.3 Wafer Level Packaging Downstream and Clients |
9.4 Marketing Channels Analysis |
| 9.4.1 Marketing Channels |
| 9.4.2 Wafer Level Packaging Distributors and Sales Agents in China Market |
10 Conclusion |
11 Appendix |
11.1 Note |
11.2 Examples of Clients |
11.3 Author Details |
11.4 Disclaimer |
| Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die.[1] Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment. |
| Wafer-level packaging consists of extending the wafer fab processes to include device interconnection and device protection processes. Most other kinds of packaging do wafer dicing first, and then put the individual die in a plastic package and attach the solder bumps. Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing. |
| There is no single industry-standard method of wafer-level packaging at present. |
| A major application area of WLPs are smartphones due to the size constraints. |
| This report contains market size and forecasts of Wafer Level Packaging in China, including the following market information: |
| China Wafer Level Packaging Market Revenue, 2016-2021, 2022-2027, ($ millions) |
| China Wafer Level Packaging Market Sales, 2016-2021, 2022-2027, (K Units) |
| China top five Wafer Level Packaging companies in 2020 (%) |
| The global Wafer Level Packaging market size is expected to growth from US$ 3610 million in 2020 to US$ 7672.4 million by 2027; it is expected to grow at a CAGR of 10.9% during 2021-2027. |
| The China Wafer Level Packaging market was valued at US$ XX million in 2020 and is projected to reach US$ XX million by 2027, at a CAGR of XX% during the forecast period. |
| has surveyed the Wafer Level Packaging manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks. |
| Total Market by Segment: |
| China Wafer Level Packaging Market, By Type, 2016-2021, 2022-2027 ($ Millions) & (K Units) |
| China Wafer Level Packaging Market Segment Percentages, By Type, 2020 (%) |
3 D TSV WLP |
2.5 D TSV WLP |
| 2022-2027年中國(guó)晶圓級(jí)封裝市場(chǎng)深度研究與趨勢(shì)報(bào)告 |
| WLCSP |
| Nano WLP |
| Others ( 2D TSV WLP and Compliant WLP) |
| China Wafer Level Packaging Market, By Application, 2016-2021, 2022-2027 ($ Millions) & (K Units) |
| China Wafer Level Packaging Market Segment Percentages, By Application, 2020 (%) |
| Electronics |
| IT & Telecommunication |
| Industrial |
| Automotive |
| Aerospace & Defense |
| Healthcare |
| Others (Media & Entertainment and Non-Conventional Energy Resources) |
| Competitor Analysis |
| The report also provides analysis of leading market participants including: |
| Key companies Wafer Level Packaging revenues in China market, 2016-2021 (Estimated), ($ millions) |
| Key companies Wafer Level Packaging revenues share in China market, 2020 (%) |
| Key companies Wafer Level Packaging sales in China market, 2016-2021 (Estimated), (K Units) |
| Key companies Wafer Level Packaging sales share in China market, 2020 (%) |
| Further, the report presents profiles of competitors in the market, key players include: |
| Amkor Technology Inc |
| Fujitsu Ltd |
| Jiangsu Changjiang Electronics |
| Deca Technologies |
| Qualcomm Inc |
| Toshiba Corp |
| Tokyo Electron Ltd |
| Applied Materials, Inc |
| ASML Holding NV |
| Lam Research Corp |
| KLA-Tencor Corration |
| China Wafer Level CSP Co. Ltd |
| Marvell Technology Group Ltd |
| Siliconware Precision Industries |
| Nanium SA |
| STATS Chip |
| PAC Ltd |
| List of Tables |
| Table 1. Key Players of Wafer Level Packaging in China Market |
| Table 2. Top Wafer Level Packaging Players in China Market, Ranking by Revenue (2019) |
| Table 3. China Wafer Level Packaging Revenue by Companies, (US$, Mn), 2016-2021 |
| Table 4. China Wafer Level Packaging Revenue Share by Companies, 2016-2021 |
| Table 5. China Wafer Level Packaging Sales by Companies, (K Units), 2016-2021 |
| Table 6. China Wafer Level Packaging Sales Share by Companies, 2016-2021 |
| Table 7. Key Manufacturers Wafer Level Packaging Price (2016-2021) & (USD/Unit) |
| Table 8. Manufacturers Wafer Level Packaging Product Type |
| Table 9. List of Tier 1 Wafer Level Packaging Companies, Revenue (US$, Mn) in 2020 and Market Share |
| Table 10. List of Tier 2 and Tier 3 Wafer Level Packaging Companies, Revenue (US$, Mn) in 2020 and Market Share |
| Table 11. Major Manufacturers of 3D TSV WLP |
| Table 12. Major Manufacturers of 2.5D TSV WLP |
| Table 13. By Type – China Wafer Level Packaging Revenue, (US$, Mn), 2021 & 2027 |
| Table 14. By Type - China Wafer Level Packaging Revenue (US$, Mn), 2016-2021 |
| Table 15. By Type - China Wafer Level Packaging Revenue (US$, Mn), 2022-2027 |
| Table 16. By Type - China Wafer Level Packaging Sales (K Units), 2016-2021 |
| Table 17. By Type - China Wafer Level Packaging Sales (K Units), 2022-2027 |
| Table 18. By Application – China Wafer Level Packaging Revenue, (US$, Mn), 2021 VS 2027 |
| Table 19. By Application - China Wafer Level Packaging Revenue (US$, Mn), 2016-2021 |
| Table 20. By Application - China Wafer Level Packaging Revenue (US$, Mn), 2022-2027 |
| Table 21. By Application - China Wafer Level Packaging Sales (K Units), 2016-2021 |
| Table 22. By Application - China Wafer Level Packaging Sales (K Units), 2022-2027 |
| Table 23. Amkor Technology Inc Corporation Information |
| Table 24. Amkor Technology Inc Description and Major Businesses |
| Table 25. Amkor Technology Inc Wafer Level Packaging Sales (K Units), Revenue (US$, Mn) and Gross Margin (USD/Unit) (2016-2021) |
| Table 26. Amkor Technology Inc Wafer Level Packaging Product |
| Table 27. Amkor Technology Inc Recent Developments |
| Table 28. Fujitsu Ltd Corporation Information |
| Table 29. Fujitsu Ltd Description and Major Businesses |
| Table 30. Fujitsu Ltd Wafer Level Packaging Sales (K Units), Revenue (US$, Mn) and Gross Margin (USD/Unit) (2016-2021) |
| Table 31. Fujitsu Ltd Wafer Level Packaging Product |
| Table 32. Fujitsu Ltd Recent Developments |
| Table 33. Jiangsu Changjiang Electronics Corporation Information |
| Table 34. Jiangsu Changjiang Electronics Description and Major Businesses |
| Table 35. Jiangsu Changjiang Electronics Wafer Level Packaging Sales (K Units), Revenue (US$, Mn) and Gross Margin (USD/Unit) (2016-2021) |
| Table 36. Jiangsu Changjiang Electronics Wafer Level Packaging Product |
| Table 37. Jiangsu Changjiang Electronics Recent Developments |
| Table 38. Deca Technologies Corporation Information |
| Table 39. Deca Technologies Description and Major Businesses |
| Table 40. Deca Technologies Wafer Level Packaging Sales (K Units), Revenue (US$, Mn) and Gross Margin (USD/Unit) (2016-2021) |
| Table 41. Deca Technologies Wafer Level Packaging Product |
| Table 42. Deca Technologies Recent Developments |
| Table 43. Qualcomm Inc Corporation Information |
| 2022-2027 Nian Zhong Guo Jing Yuan Ji Feng Zhuang Shi Chang ShenDu YanJiu Yu Qu Shi Bao Gao |
| Table 44. Qualcomm Inc Description and Major Businesses |
| Table 45. Qualcomm Inc Wafer Level Packaging Sales (K Units), Revenue (US$, Mn) and Gross Margin (USD/Unit) (2016-2021) |
| Table 46. Qualcomm Inc Wafer Level Packaging Product |
| Table 47. Qualcomm Inc Recent Developments |
| Table 48. Toshiba Corp Corporation Information |
| Table 49. Toshiba Corp Description and Major Businesses |
| Table 50. Toshiba Corp Wafer Level Packaging Sales (K Units), Revenue (US$, Mn) and Gross Margin (USD/Unit) (2016-2021) |
| Table 51. Toshiba Corp Wafer Level Packaging Product |
| Table 52. Toshiba Corp Recent Developments |
| Table 53. Tokyo Electron Ltd Corporation Information |
| Table 54. Tokyo Electron Ltd Description and Major Businesses |
| Table 55. Tokyo Electron Ltd Wafer Level Packaging Sales (K Units), Revenue (US$, Mn) and Gross Margin (USD/Unit) (2016-2021) |
| Table 56. Tokyo Electron Ltd Wafer Level Packaging Product |
| Table 57. Tokyo Electron Ltd Recent Developments |
| Table 58. Applied Materials, Inc Corporation Information |
| Table 59. Applied Materials, Inc Description and Major Businesses |
| Table 60. Applied Materials, Inc Wafer Level Packaging Sales (K Units), Revenue (US$, Mn) and Gross Margin (USD/Unit) (2016-2021) |
| Table 61. Applied Materials, Inc Wafer Level Packaging Product |
| Table 62. Applied Materials, Inc Recent Developments |
| Table 63. ASML Holding NV Corporation Information |
| Table 64. ASML Holding NV Description and Major Businesses |
| Table 65. ASML Holding NV Wafer Level Packaging Sales (K Units), Revenue (US$, Mn) and Gross Margin (USD/Unit) (2016-2021) |
| Table 66. ASML Holding NV Wafer Level Packaging Product |
| Table 67. ASML Holding NV Recent Developments |
| Table 68. Lam Research Corp Corporation Information |
| Table 69. Lam Research Corp Description and Major Businesses |
| Table 70. Lam Research Corp Wafer Level Packaging Sales (K Units), Revenue (US$, Mn) and Gross Margin (USD/Unit) (2016-2021) |
| Table 71. Lam Research Corp Wafer Level Packaging Product |
| Table 72. Lam Research Corp Recent Developments |
| Table 73. KLA-Tencor Corration Corporation Information |
| Table 74. KLA-Tencor Corration Description and Major Businesses |
| Table 75. KLA-Tencor Corration Wafer Level Packaging Sales (K Units), Revenue (US$, Mn) and Gross Margin (USD/Unit) (2016-2021) |
| Table 76. KLA-Tencor Corration Wafer Level Packaging Product |
| Table 77. KLA-Tencor Corration Recent Developments |
| Table 78. China Wafer Level CSP Co. Ltd Corporation Information |
| Table 79. China Wafer Level CSP Co. Ltd Description and Major Businesses |
| Table 80. China Wafer Level CSP Co. Ltd Wafer Level Packaging Sales (K Units), Revenue (US$, Mn) and Gross Margin (USD/Unit) (2016-2021) |
| Table 81. China Wafer Level CSP Co. Ltd Wafer Level Packaging Product |
| Table 82. China Wafer Level CSP Co. Ltd Recent Developments |
| Table 83. Marvell Technology Group Ltd Corporation Information |
| Table 84. Marvell Technology Group Ltd Description and Major Businesses |
| Table 85. Marvell Technology Group Ltd Wafer Level Packaging Sales (K Units), Revenue (US$, Mn) and Gross Margin (USD/Unit) (2016-2021) |
| Table 86. Marvell Technology Group Ltd Wafer Level Packaging Product |
| Table 87. Marvell Technology Group Ltd Recent Developments |
| Table 88. Siliconware Precision Industries Corporation Information |
| Table 89. Siliconware Precision Industries Description and Major Businesses |
| Table 90. Siliconware Precision Industries Wafer Level Packaging Sales (K Units), Revenue (US$, Mn) and Gross Margin (USD/Unit) (2016-2021) |
| Table 91. Siliconware Precision Industries Wafer Level Packaging Product |
| Table 92. Siliconware Precision Industries Recent Developments |
| Table 93. Nanium SA Corporation Information |
| Table 94. Nanium SA Description and Major Businesses |
| Table 95. Nanium SA Wafer Level Packaging Sales (K Units), Revenue (US$, Mn) and Gross Margin (USD/Unit) (2016-2021) |
| Table 96. Nanium SA Wafer Level Packaging Product |
| Table 97. Nanium SA Recent Developments |
| Table 98. STATS Chip Corporation Information |
| Table 99. STATS Chip Description and Major Businesses |
| Table 100. STATS Chip Wafer Level Packaging Sales (K Units), Revenue (US$, Mn) and Gross Margin (USD/Unit) (2016-2021) |
| Table 101. STATS Chip Wafer Level Packaging Product |
| Table 102. STATS Chip Recent Developments |
| Table 103. PAC Ltd Corporation Information |
| Table 104. PAC Ltd Description and Major Businesses |
| Table 105. PAC Ltd Wafer Level Packaging Sales (K Units), Revenue (US$, Mn) and Gross Margin (USD/Unit) (2016-2021) |
| Table 106. PAC Ltd Wafer Level Packaging Product |
| Table 107. PAC Ltd Recent Developments |
| Table 108. Wafer Level Packaging Production Capacity (K Units) of Key Manufacturers in China Market, 2019-2021 (K Units) |
| Table 109. China Wafer Level Packaging Capacity Market Share of Key Manufacturers, 2019-2021 |
| Table 110. Wafer Level Packaging Market Opportunities & Trends in China Market |
| Table 111. Wafer Level Packaging Market Drivers in China Market |
| Table 112. Wafer Level Packaging Market Restraints in China Market |
| Table 113. Wafer Level Packaging Raw Materials |
| Table 114. Wafer Level Packaging Raw Materials Suppliers in China Market |
| Table 115. Typical Wafer Level Packaging Downstream |
| Table 116. Wafer Level Packaging Downstream Clients in China Market |
| Table 117. Wafer Level Packaging Distributors and Sales Agents in China Market |
| List of Figures |
| 中國(guó)のウェーハレベルパッケージング市場(chǎng)の詳細(xì)な調(diào)査と傾向レポート2022-2027 |
| Figure 1. Wafer Level Packaging Product Picture |
| Figure 2. Wafer Level Packaging Segment by Type |
| Figure 3. Wafer Level Packaging Segment by Application |
| Figure 4. China Wafer Level Packaging Market Overview: 2020 |
| Figure 5. China Wafer Level Packaging Market Size: 2021 VS 2027 (US$, Mn) |
| Figure 6. China Wafer Level Packaging Revenue, 2016-2027 (US$, Mn) |
| Figure 7. Wafer Level Packaging Sales in China Market: 2016-2027 (K Units) |
| Figure 8. The Top 3 and 5 Players Market Share by Wafer Level Packaging Revenue in 2020 |
| Figure 9. 3D TSV WLP Product Picture |
| Figure 10. 2.5D TSV WLP Product Picture |
| Figure 11. WLCSP Product Picture |
| Figure 12. Nano WLP Product Picture |
| Figure 13. Others ( 2D TSV WLP and Compliant WLP) Product Picture |
| Figure 14. By Type - China Wafer Level Packaging Sales Market Share, 2016-2027 |
| Figure 15. By Type - China Wafer Level Packaging Revenue Market Share, 2016-2027 |
| Figure 16. By Type - China Wafer Level Packaging Price (USD/Unit), 2016-2027 |
| Figure 17. Electronics |
| Figure 18. IT & Telecommunication |
| Figure 19. Industrial |
| Figure 20. Automotive |
| Figure 21. Aerospace & Defense |
| Figure 22. By Application - China Wafer Level Packaging Sales Market Share, 2016-2027 |
| Figure 23. By Application - China Wafer Level Packaging Revenue Market Share, 2016-2027 |
| Figure 24. By Application - China Wafer Level Packaging Price (USD/Unit), 2016-2027 |
| Figure 25. Amkor Technology Inc Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2016-2021) |
| Figure 26. Fujitsu Ltd Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2016-2021) |
| Figure 27. Jiangsu Changjiang Electronics Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2016-2021) |
| Figure 28. Deca Technologies Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2016-2021) |
| Figure 29. Qualcomm Inc Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2016-2021) |
| Figure 30. Toshiba Corp Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2016-2021) |
| Figure 31. Tokyo Electron Ltd Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2016-2021) |
| Figure 32. Applied Materials, Inc Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2016-2021) |
| Figure 33. ASML Holding NV Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2016-2021) |
| Figure 34. Lam Research Corp Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2016-2021) |
| Figure 35. KLA-Tencor Corration Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2016-2021) |
| Figure 36. China Wafer Level CSP Co. Ltd Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2016-2021) |
| Figure 37. Marvell Technology Group Ltd Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2016-2021) |
| Figure 38. Siliconware Precision Industries Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2016-2021) |
| Figure 39. Nanium SA Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2016-2021) |
| Figure 40. STATS Chip Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2016-2021) |
| Figure 41. PAC Ltd Wafer Level Packaging Revenue Year Over Year Growth (US$, Mn) & (2016-2021) |
| Figure 42. China Wafer Level Packaging Production Capacity (K Units), 2016-2027 |
| Figure 43. Wafer Level Packaging Industry Value Chain |
| Figure 44. Marketing Channels |
…
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